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 HIGH-SPEED 3.3V 16/8K X 9 DUAL-PORT STATIC RAM
.eatures
x x
PRELIMINARY IDT70V16/5S/L
x
x
True Dual-Ported memory cells which allow simultaneous reads of the same memory location High-speed access - Commercial:15/20/25ns (max.) - Industrial: 20ns (max.) Low-power operation - IDT70V16/5S Active: 430mW (typ.) Standby: 3.3mW (typ.) - IDT70V16/5L Active: 415mW (typ.) Standby: 660W (typ.) IDT70V16/5 easily expands data bus width to 18 bits or
x
x x x
x x x x
more using the Master/Slave select when cascading more than one device M/S = VIH for BUSY output flag on Master M/S = VIL for BUSY input on Slave Busy and Interrupt Flag On-chip port arbitration logic Full on-chip hardware support of semaphore signaling between ports Fully asynchronous operation from either port LVTTL-compatible, single 3.3V (+0.3V) power supply Available in 68-pin PLCC and an 80-pin TQFP Industrial temperature range (-40C to +85C) is available for selected speeds
.unctional Block Diagram
OEL CEL R/WL OER CER R/WR
I/O0L- I/O8L I/O Control BUSYL A13L(1) A0L
(2,3)
I/O0R-I/O8R I/O Control BUSYR Address Decoder
14
(2,3)
MEMORY ARRAY
14
Address Decoder
A13R(1) A0R
CEL OEL R/WL
ARBITRATION INTERRUPT SEMAPHORE LOGIC
CER OER R/WR
SEML (3) INTL
NOTES: 1. A13 is a NC for IDT70V15. 2. In MASTER mode: BUSY is an output and is a push-pull driver In SLAVE mode: BUSY is input. 3. BUSY outputs and INT outputs are non-tri-stated push-pull drivers.
M/S
SEMR (3) INTR
5669 drw 01
AUGUST 2002
1
(c)2002 Integrated Device Technology, Inc. DSC 5669/1
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
Description
The IDT70V16/5 is a high-speed 16/8K x 9 Dual-Port Static RAM. The IDT70V16/5 is designed to be used as stand-alone Dual-Port RAMs or as a combination MASTER/SLAVE Dual-Port RAM for 18-bit-or-more wider systems. Using the IDT MASTER/SLAVE Dual-Port RAM approach in 18-bit or wider memory system applications results in full-speed, error-free operation without the need for additional discrete logic. This device provides two independent ports with separate control, address, and I/O pins that permit independent, asynchronous access for reads or writes to any location in memory. An automatic power down feature controlled by CE permits the on-chip circuitry of each port to enter a very low standby power mode. Fabricated using IDT's CMOS high-performance technology, these devices typically operate on only 430mW of power. The IDT70V16/5 is packaged in a 64-pin PLCC (Plastic Leaded Chip Carriers) and an 80-pinTQFP (Thin Quad Flatpack).
Pin Configurations(1,2,3,4)
08/26/02
INDEX I/O2L I/O3L I/O4L I/O5L VSS I/O6L I/O7L VDD VSS I/O0R I/O1R I/O2R VDD I/O3R I/O4R I/O5R I/O6R
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
9
I/O1L I/O0L I/O8L OEL R/WL SEML CEL N/C A13L(1) VDD A12L A11L A10L A9L A8L A7L A6L
8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 60 59 58 57 56
IDT70V16/5J J68-1(5) 68-Pin PLCC Top View(6)
55 54 53 52 51 50 49 48 47 46 45
26 44 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
A5L A4L A3L A2L A1L A0L INTL BUSYL VSS M/S BUSYR INTR A0R A1R A2R A3R A4R
5669 drw 02
,
NOTES: 1. A13 is a NC for IDT70V15. 2. All VDD pins must be connected to power supply. 3. All VSS pins must be connected to ground supply. 4. Package body is approximately .95 in x .95 in x .17 in. 5. This package code is used to reference the package diagram. 6. This text does not imply orientation of Part-marking.
I/O7R I/O8R OER R/WR SEMR CER N/C A13R(1) VSS A12R A11R A10R A9R A8R A7R A6R A5R
2 6.42
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
Pin Configurations(1,2,3,4) (con't.)
I/O1L
I/O0L
I/O8L
NC A13L(1)
R/WL
SEML
VDD
A12L
A10L
OEL
CEL
A9L
A7L
A8L
NC
A6L 63
INDEX
79 78 77
65
62
69
68 67
75
72
76
80
74 73
71
66
64
61
70
NC NC
60 59 58 57 56 55 54
08/26/02
A11L
NC I/O2L I/O3L I/O4L I/O5L
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
NC A5L A4L A3L A2L A1L A0L INTL BUSYL
VSS
I/O6L I/O7L
VDD
NC
IDT70V16/5PF PN80-1(5) 80-Pin TQFP Top View(6)
53 52 51 50 49 48 47 46 45 44 43 42
VSS
M/S BUSYR INTR A0R A1R A2R A3R A4R NC NC
VSS
I/O0R I/O1R I/O2R
VDD
I/O3R I/O4R I/O5R I/O6R NC
27
31
34
26
36
35
38
30
33
37
24 25
28
29
32
39
40
20
22 23
21
41
I/O7R I/O8R OER
NC A13R(1)
SEMR
A10R
CER
R/WR
A11R
A9R A8R
NC
A12R
A7R
A6R
VSS
A5R NC
NOTES: 1. A13 is a NC for IDT70V15. 2. All VDD pins must be connected to power supply. 3. All VSS pins must be connected to ground supply. 4. PN80-1 package body is approximately 14mm x 14mm x 1.4mm. 5. This package code is used to reference the package diagram. 6. This text does not indicate orientation of the actual part-marking.
6.42 3
NC
5669 drw 03
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
Pin Names
Left Port CEL R/WL OEL A0L - A13L
(1)
Right Port CER R/WR OER A0R - A13R
(1)
Names Chip Enable Read/Write Enable Output Enable Address Data Input/Output Semaphore Enable Interrupt Flag Busy Flag Master or Slave Select Power (3.3V) Ground (0V)
5669 tbl 01
I/O0L - I/O8L SEML INTL BUSYL
I/O0R - I/O8R SEMR INTR BUSYR M/S VCC GND
NOTE: 1. A13 is a NC for IDT70V15.
Truth Table I: Non-Contention Read/Write Control
Inputs(1) CE H L L X R/W X L H X OE X X L H SEM H H H X Outputs I/O0-8 High-Z DATAIN DATAOUT High-Z Deselcted: Power-Down Write to Memory Read Memory Outputs Disabled
5669 tbl 02
Mode
NOTE: 1. Condition: A0L -- A13L A0R -- A13R
Truth Table II: Semaphore Read/Write Control(1)
Inputs CE H H L R/W H X OE L X X SEM L L L Outputs I/O0-8 DATAOUT DATAIN
____
Mode Read Semaphore Flag Data Out (I/O0 - I/O8) Write I/O0 into Semaphore Flag Not Allowed
5669 tbl 03
NOTE: 1. There are eight semaphore flags written to via I/O0 and read from all I/Os (I/O0-I/O8). These eight semaphores are addressed by A0 - A2.
4 6.42
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
Absolute Maximum Ratings(1)
Symbol VTERM
(2)
Rating Terminal Voltage with Respect to GND Temperature Under Bias Storage Temperature Junction Temperature DC Output Current
Commercial & Industrial -0.5 to +3.6 -55 to +125 -65 to +150 +150 50
Unit V
Maximum Operating Temperature and Supply Voltage(1)
Grade Commercial Ambient Temperature 0OC to +70OC -40OC to +85OC GND 0V 0V Vcc 3.3V + 0.3V 3.3V + 0.3V
5669 tbl 05
TBIAS(3) TSTG TJN IOUT
o
C C C
Industrial
o o
NOTES: 1. This is the parameter TA. This is the "instant on" case temperature.
mA
5669 tbl 04
NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VTERM must not exceed VDD + 0.3V. 3. Ambient Temperature Under Bias. No AC Conditions. Chip Deselected.
Recommended DC Operating Conditions
Symbol VDD VSS VIH VIL Parameter Supply Voltage Ground Input High Voltage Input Low Voltage Min. 3.0 0 2.0 -0.3
(1)
Typ. 3.3 0
____
Max. 3.6 0 VDD+0.3 0.8
(2)
Unit V V V V
5669 tbl 06
____
Capacitance(1)(TA = +25C, f = 1.0MHz)
Symbol CIN COUT Parameter Input Capacitance Output Capacitance Conditions(2) VIN = 3dV VOUT = 3dV Max. 9 10 Unit pF pF
5669 tbl 07
NOTES: 1. VIL > -1.5V for pulse width less than 10ns. 2. VTERM must not exceed VDD + 0.3V.
NOTES: 1. This parameter is determined by device characteristics but is not production tested. 2. 3dV references the interpolated capacitance when the input and output signals switch from 0V to 3V or from 3V to 0V .
DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VDD = 3.3V 0.3V)
70V16/5S Symbol |ILI| |ILO| VOL VOH Parameter Input Leakage Current
(1)
70V16/5L Min.
___
Test Conditions VDD = 3.6V, VIN = 0V to VDD CE = VIH, VOUT = 0V to VDD IOL = +4mA IOH = -4mA
Min.
___
Max. 10 10 0.4
___
Max. 5 5 0.4
___
Unit A A V V
5669 tbl 08
Output Leakage Currentt(1) Output Low Voltage Output High Voltage
___
___
___
___
2.4
2.4
NOTE: 1. At VDD < 2.0V, Input leakages are undefined.
6.42 5
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(1) (VDD = 3.3V 0.3V)
70V16/5X15 Com'l Only Symbol IDD Parameter Dynamic Operating Current (Both Ports Active) Test Condition CE = VIL, Outputs Disabled SEM = VIH f = fMAX(3) Version COM'L IND COM'L MIL & IND COM'L MIL & IND COM'L MIL & IND COM'L MIL & IND S L S L S L S L S L S L S L S L S L S L Typ. (2) 150 140
____ ____
70V16/5X20 Com'l & Ind Typ.(2) 140 130 140 130 20 15 20 15 80 75 80 75 1.0 0.2 1.0 0.2 80 75 80 75 Max. 200 175 225 195 30 25 45 40 110 100 130 115 5 2.5 15 5 115 100 130 115
70V16/5X25 Com'l Only Typ.(2) 130 125
____ ____
Max. 215 185
____ ____
Max. 190 165
____ ____
Unit mA
ISB1
Standby Current (Both Ports - TTL Level Inputs)
CER and CEL = VIH SEMR = SEML = VIH f = fMAX(3)
25 20
____ ____
35 30
____ ____
16 13
____ ____
30 25
____ ____
mA
ISB2
Standby Current (One Port - TTL Level Inputs)
CE"A" = VIL and CE"B" = VIH(5) Active Port Outputs Disabled, f=fMAX(3) SEMR = SEML = VIH Both Ports CEL and CER > VDD - 0.2V, VIN > VDD - 0.2V or VIN < 0.2V, f = 0 (4) SEMR = SEML > VDD - 0.2V CE"A" < 0.2V and CE"B" > VDD - 0.2V(5) SEMR = SEML > VDD - 0.2V VIN > VDD - 0.2V or VIN < 0.2V Active Port Outputs Disabled, f = fMAX(3)
85 80
____ ____
120 110
____ ____
75 72
____ ____
110 95
____ ____
mA
ISB3
Full Standby Current (Both Ports CMOS Level Inputs)
1.0 0.2
____ ____
5 2.5
____ ____
1.0 0.2
____ ____
5 2.5
____ ____
mA
ISB4
Full Standby Current (One Port CMOS Level Inputs)
85 80
____ ____
125 105
____ ____
75 70
____ ____
105 90
____ ____
mA
NOTES: 1. 'X' in part number indicates power rating (S or L) 2. VDD = 3.3V, TA = +25C, and are not production tested. IDD DC = 115mA (typ.) 3. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/tRC, and using "AC Test Conditions" of input levels of GND to 3V. 4. f = 0 means no address or control lines change. 5. Port "A" may be either left or right port. Port "B" is the opposite from port "A".
5669 tbl 09
Output Loads and AC Test Conditions
Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels Output Load GND to 3.0V 3ns Max. 1.5V 1.5V Figures 1 and 2
5669 tbl 10
, 5669 drw 04
3.3V 590 DATAOUT BUSY INT DATAOUT 435 30pF 435
3.3V
590
5pF*
Figure 1. AC Output Test Load
Figure 2. Output Test Load
(for tLZ, tHZ, tWZ, tOW) *Including scope and jig.
Timing of Power-Up / Power-Down
CE tPU ICC 50% ISB
5669 drw 07
tPD 50%
,
6 6.42
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(4)
70V16/5X15 Com'l Only Symbol READ CYCLE tRC tAA tACE tABE tAOE tOH tLZ tHZ tPU tPD tSOP tSAA Read Cycle Time Address Access Time Chip Enable Access Time (3) Byte Enable Access Time (3) Output Enable Access Time (3) Output Hold from Address Change Output Low-Z Time
(1,2)
70V16/5X20 Com'l & Ind Min. Max.
70V16/5X25 Com'l Only Min. Max. Unit
Parameter
Min.
Max.
15
____
____
20
____
____
25
____
____
ns ns ns ns ns ns ns ns ns ns ns ns
5669 tbl 11
15 15 15 10
____
20 20 20 12
____
25 25 25 13
____
____
____
____
____
____
____
____
____
____
3 3
____
3 3
____
3 3
____
____
____
____
Output High-Z Time(1,2) Chip Enable to Power Up Time (1,2) Chip Disable to Power Down Time (1,2) Semaphore Flag Update Pulse (OE or SEM) Semaphore Address Access
(3)
10
____
12
____
15
____
0
____
0
____
0
____
15
____
20
____
25
____
10
____
10
____
10
____
15
20
25
NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with Output Test Load (Figure 2). 2. This parameter is guaranteed by device characterization, but is not production tested. 3. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. 4. 'X' in part number indicates power rating (S or L).
Waveform of Read Cycles(5)
tRC ADDR tAA (4) tACE tAOE OE
(4) (4)
CE
R/W tLZ DATAOUT
(1)
tOH VALID DATA
(4) (2)
tHZ BUSYOUT tBDD(3,4)
5669 drw 06
NOTES: 1. Timing depends on which signal is asserted last, OE or CE. 2. Timing depends on which signal is de-asserted first, CE or OE. 3. tBDD delay is required only in cases where the opposite port is completing a write operation to the same address location. For simultaneous read operations BUSY has no relation to valid output data. 4. Start of valid data depends on which timing becomes effective last: tAOE, tACE, tAA or tBDD. 5. SEM = VIH.
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the Operating Temperature and Supply Voltage(5)
70V16/5X15 Com'l Only Symbol WRITE CYCLE tWC tEW tAW tAS tWP tWR tDW tHZ tDH tWZ tOW tSWRD tSPS Write Cycle Time Chip Enable to End-of-Write(3) Address Valid to End-of-Write Address Set-up Time (3) Write Pulse Width Write Recovery Time Data Valid to End-of-Write Output High-Z Time(1,2) Data Hold Time(4) Write Enable to Output in High-Z(1,2) Output Active from End-of-Write(1,2,4) SEM Flag Write to Read Time SEM Flag Contention Window 15 12 12 0 12 0 10
____ ____
70V16/5X20 Com'l & Ind Min. Max.
70V16/5X25 Com'l Only Min. Max. Unit
Parameter
Min.
Max.
20 15 15 0 15 0 15
____
____
25 20 20 0 20 0 15
____
____
ns ns ns ns ns ns ns ns ns ns ns ns ns
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
10
____
12
____
15
____
0
____
0
____
0
____
10
____
12
____
15
____
0 5 5
0 5 5
0 5 5
____
____
____
____
____
____
5669 tbl 12 NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 2. This parameter is guaranteed by device characterization but not production tested. 3. To access SRAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. Either condition must be valid for the entire tEW time. 4. The specification for tDH must be met by the device supplying write data to the SRAM under all operating conditions. Although tDH and tOW values will vary over voltageand temperature, the actual tDH will always be smaller than the actual tOW. 5. 'X' in part numbers indicates power rating (S or L).
8 6.42
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(1,5,8)
tWC ADDRESS tHZ (7) OE tAW CE or SEM
(9)
tAS (6) R/W tLZ DATAOUT tWZ (7)
(4)
tWP (2)
tWR
(3)
tOW
(4)
tDW DATAIN
tDH
5669 drw 08
Timing Waveform of Write Cycle No. 2, CE Controlled Timing(1,5)
tWC ADDRESS tAW CE or SEM
(9) (6)
tAS R/W
tEW (2)
tWR
(3)
tDW DATAIN
tDH
5669 drw 09
NOTES: 1. R/W or CE must be HIGH during all address transitions. 2. A write occurs during the overlap (tEW or tWP) of a LOW CE and a LOW R/W for memory array writing cycle. 3. tWR is measured from the earlier of CE or R/W (or SEM or R/W) going HIGH to the end of write cycle. 4. During this period, the I/O pins are in the output state and input signals must not be applied. 5. If the CE or SEM LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the High-impedance state. 6. Timing depends on which enable signal is asserted last, CE or R/W. 7. This parameter is guaranteed by device characterization but is not production tested. Transition is measured 0mV from steady state with the Output Test Load (Figure 2). 8. If OE is LOW during R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off and data to be placed on the bus for the required tDW. If OE is HIGH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified tWP. 9. To access RAM, CE = VIL and SEM = VIH. To access Semaphore, CE = VIH and SEM = VIL. tEW must be met for either condition.
6.42 9
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
Timing Waveform of Semaphore Read after Write Timing, Either Side(1)
tSAA A0-A2 VALID ADDRESS tAW SEM tEW tDW DATAIN VALID tAS R/W tSWRD OE
Write Cycle Read Cycle
5669 drw 10
VALID ADDRESS tACE tOH tSOP DATAOUT VALID(2)
tWR
I/O tWP
tDH
tAOE
NOTES: 1. CE = VIH for the duration of the above timing (both write and read cycle). 2. "DATAOUT VALID" represents all I/O's (I/O0-I/O8) equal to the semaphore value.
Timing Waveform of Semaphore Write Condition(1,3,4)
A0"A"-A2 "A" MATCH
SIDE
(2)
"A"
R/W"A"
SEM"A" tSPS A0"B"-A2 "B" MATCH
SIDE
(2)
"B"
R/W"B"
SEM"B"
5669 drw 11
NOTES: 1. DOR = DOL =VIH, CER = CEL =VIH. 2. All timing is the same for left and right ports. Port"A" may be either left or right port. "B" is the opposite port from "A". 3. This parameter is measured from R/W"A" or SEM"A" going HIGH to R/W"B" or SEM"B" going HIGH. 4. If tSPS is not satisfied, there is no guarantee which side will obtain the semaphore flag.
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(6)
70V16/5X15 Com'l Ony Symbol BUSY TIMING (M/S = VIH) tBAA tBDA tBAC tBDC tAPS tBDD tWH BUSY Access Time from Address Match BUSY Disable Time from Address Not Matched BUSY Ac cess Time from Chip Enable LOW BUSY Disable Time from Chip Enable HIGH Arbitration Priority Set-up Time (2) BUSY Disable to Valid Data(3) Write Hold After BUSY
(5)
____
70V16/5X20 Com'l & Ind Min. Max.
70V16/5X25 Com'l Only Min. Max. Unit
Parameter
Min.
Max.
15 15 15 15
____
____
20 20 20 17
____
____
20 20 20 17
____
ns ns ns ns ns ns ns
____
____
____
____
____
____
____
____
____
5
____
5
____
5
____
18
____
30
____
30
____
12
15
17
BUSY TIMING (M/S = VIL) tWB tWH BUSY Input to Write(4) Write Hold After BUSY
(5)
0 12
____
0 15
____
0 17
____
ns ns
____
____
____
PORT-TO-PORT DELAY TIMING tWDD tDDD Write Pulse to Data Delay(1) Write Data Valid to Read Data Delay
(1)
____ ____
30 25
____ ____
45 35
____ ____
50 35
ns ns
5669 tbl 13
NOTES: 1. Port-to-port delay through SRAM cells from writing port to reading port, refer to "Timing Waveform of Write with Port-to-Port Read and BUSY (M/S = VIH)". 2. To ensure that the earlier of the two ports wins. 3. tBDD is a calculated parameter and is the greater of 0, tWDD - tWP (actual) or tDDD - tDW (actual). 4. To ensure that the write cycle is inhibited during contention. 5. To ensure that a write cycle is completed after contention. 6. 'X' in part numbers indicates power rating (S or L).
Timing Waveform of Read with BUSY(2,4,5) (M/S = VIH)
tWC ADDR"A" MATCH tWP R/W"A" tDW DATAIN "A" tAPS ADDR"B"
(1)
tDH VALID
MATCH tBDA tBDD
BUSY"B" tWDD DATAOUT "B" tDDD NOTES: 1. To ensure that the earlier of the two ports wins. tAPS is ignored for M/S=VIL. 2. CEL = CER = VIL. 3. OE = VIL for the reading port. 4. If M/S=VIL (SLAVE), BUSY is an input. Then for this example BUSY"A" = VIH and BUSY"B" input is shown above. 5. All timing is the same for left and right ports. Port "A" may be either the left or right port. Port "B" is the port opposite from Port "A".
(3)
VALID
5669 drw 12
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Timing Waveform of Write with BUSY(3)
tWP R/W"A" tWB BUSY"B" tWH
(1)
R/W"B"
(2)
5669 drw 13
NOTES: 1. tWH must be met for both BUSY input (SLAVE) and output (MASTER). 2. BUSY is asserted on port "B" blocking R/W"B", until BUSY"B" goes HIGH. 3. All timing is the same for left and right ports. Port "A" may be either the left or right port. Port "B" is the port opposite from Port "A".
Waveform of BUSY Arbitration Controlled by CE Timing(1) (M/S = VIH)
ADDR"A" and "B" ADDRESSES MATCH
CE"A" tAPS (2) CE"B" tBAC BUSY"B"
5669 drw 14
tBDC
Waveform of BUSY Arbitration Cycle Controlled by Address Match Timing(1) (M/S = VIH)
ADDR"A" tAPS ADDR"B" tBAA BUSY"B"
5669 drw 15 (2)
ADDRESS "N"
MATCHING ADDRESS "N" tBDA
NOTES: 1. All timing is the same for left and right ports. Port "A" may be either the left or right port. Port "B" is the port opposite from "A". 2. If tAPS is not satisfied, the BUSY signal will be asserted on one side or another but there is no guarantee on which side BUSY will be asserted.
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AC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(1)
70V16/5X15 Com 'l Only Sym bol INTERRUPT TIMING tA S tW R tIN S tIN R A d d re ss Se t-up Tim e Write Re co ve ry Tim e Inte rrup t S e t Tim e Inte rrup t Re se t Tim e 0 0
____ ____ ____ ____
70V16/5X20 Com 'l & Ind Min. Max.
70V16/5X25 Com 'l Only Min. Max. Unit
Param eter
Min.
Max.
0 0
____ ____
____ ____
0 0
____ ____
____ ____
ns ns ns ns
5669 tb l 1 4
15 15
20 20
20 20
NOTES: 1. 'X' in part numbers indicates power rating (S or L).
Waveform of Interrupt Timing(1)
tWC ADDR"A" tAS CE"A"
(3)
INTERRUPT SET ADDRESS
(2) (4)
tWR
R/W"A" tINS INT"B"
5669 drw 16 (3)
tRC ADDR"B" tAS CE"B"
(3)
INTERRUPT CLEAR ADDRESS
(2)
OE"B" tINR INT"B"
5669 drw 17 (3)
NOTES: 1. All timing is the same for left and right ports. Port "A" may be either the left or right port. Port "B" is the port opposite from "A". 2. See Interrupt truth table. 3. Timing depends on which enable signal (CE or R/W) is asserted last. 4. Timing depends on which enable signal (CE or R/W) is de-asserted first.
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
Truth Table III Interrupt .lag(1)
Left Port R/WL L X X X CEL L X X L OEL X X X L A13L-A0L 3FFF(4) X X 3FFE(4) INTL X X L(3) H(2) R/WR X X L X CER X L L X Right Port OER X L X X A13R-A0R X 3FFF(4) 3FFE(4) X INTR L(2) H(3) X X Function Set Right INTR Flag Reset Right INTR Flag Set Left INTL Flag Reset Left INTL Flag
5669 tbl 15
NOTES: 1. Assumes BUSYL = BUSYR = VIH. 2. If BUSYL = VIL, then no change. 3. If BUSYR = VIL, then no change. 4. A13 is a NC for IDT70V15, therefore Interrupt Addresses are 1FFF and 1FFE.
Truth Table IV Address BUSY Arbitration
Inputs CEL X H X L CER X X H L AOL-A13L AOR-A13R NO MATCH MATCH MATCH MATCH Outputs BUSYL(1) H H H (2) BUSYR(1) H H H (2) Function Normal Normal Normal Write Inhibit(3)
5669 tbl 16
NOTES: 1. Pins BUSYL and BUSYR are both outputs when the part is configured as a master. Both are inputs when configured as a slave. BUSYX outputs on the IDT70V16/5 are push-pull, not open drain outputs. On slaves the BUSYX input internally inhibits writes. 2. "L" if the inputs to the opposite port were stable prior to the address and enable inputs of this port. "H" if the inputs to the opposite port became stable after the address and enable inputs of this port. If tAPS is not met, either BUSYL or BUSYR = LOW will result. BUSYL and BUSYR outputs can not be LOW simultaneously. 3. Writes to the left port are internally ignored when BUSYL outputs are driving LOW regardless of actual logic level on the pin. Writes to the right port are internally ignored when BUSYR outputs are driving LOW regardless of actual logic level on the pin. 4. A13 a NC for IDT70V15, Address comparison will be for A0 - A12.
Truth Table V Example of Semaphore Procurement Sequence(1,2,3)
Functions No Action Left Port Writes "0" to Semaphore Right Port Writes "0" to Semaphore Left Port Writes "1" to Semaphore Left Port Writes "0" to Semaphore Right Port Writes "1" to Semaphore Left Port Writes "1" to Semaphore Right Port Writes "0" to Semaphore Right Port Writes "1" to Semaphore Left Port Writes "0" to Semaphore Left Port Writes "1" to Semaphore D0 - D8 Left 1 0 0 1 1 0 1 1 1 0 1 D0 - D8 Right 1 1 1 0 0 1 1 0 1 1 1 Semaphore free Left port has semaphore token No change. Right side has no write access to semaphore Right port obtains semaphore token No change. Left port has no write access to semaphore Left port obtains semaphore token Semaphore free Right port has semaphore token Semaphore free Left port has semaphore token Semaphore free
5669 tbl 17
Status
NOTES: 1. This table denotes a sequence of events for only one of the eight semaphores on the IDT70V16/5. 2. There are eight semaphore flags written to via I/O0 and read from all I/Os (I/O0 - I/O8). These eight semaphores are addressed by A0 - A2. e. CE = VIH, SEM = VIL to access the semaphores. Refer to the semaphore Read/Write Truth Table.
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
CE MASTER Dual Port RAM BUSY (L) BUSY (R)
CE SLAVE Dual Port RAM BUSY (L) BUSY (R)
BUSY (L)
MASTER CE Dual Port RAM BUSY (L) BUSY (R)
SLAVE CE Dual Port RAM BUSY (L) BUSY (R)
BUSY (R)
5669 drw 18
Figure 3. Busy and chip enable routing for both width and depth expansion with IDT70V16/5 RAMs.
.unctional Description
The IDT70V16/5 provides two ports with separate control, address and I/O pins that permit independent access for reads or writes to any location in memory. The IDT70V16/5 has an automatic power down feature controlled by CE. The CE controls on-chip power down circuitry that permits the respective port to go into a standby mode when not selected (CE HIGH). When a port is enabled, access to the entire memory array is permitted.
the BUSY pins HIGH. If desired, unintended write operations can be prevented to a port by tying the BUSY pin for that port LOW. The BUSY outputs on the IDT70V16/5 RAM in master mode, are push-pull type outputs and do not require pull up resistors to operate. If these RAMs are being expanded in depth, then the BUSY indication for the resulting array requires the use of an external AND gate.
Interrupts
If the user chooses the interrupt function, a memory location (mail box or message center) is assigned to each port. The left port interrupt flag (INTL) is asserted when the right port writes to memory location 3FFE where a write is defined as the CE = R/W = VIL per Truth Table III. The left port clears the interrupt by an address location 3FFE access when CER =OER =VIL, R/W is a "don't care". Likewise, the right port interrupt flag (INTR) is asserted when the left port writes to memory location 3FFF (1FFF for IDT70V15) and to clear the interrupt flag (INTR), the right port must access location 3FFF. The message (9 bits) at 3FFE or 3FFF (1FFE or 1FFF for IDT70V15) is user-defined since it is in an addressable SRAM location. If the interrupt function is not used, address locations 3FFE and 3FFF (1FFE and 1FFF for IDT70V15) are not used as mail boxes but are still part of the random access memory. Refer to Truth Table III for the interrupt operation.
Width Expansion Busy Logic Master/Slave Arrays
When expanding an IDT70V16/5 RAM array in width while using BUSY logic, one master part is used to decide which side of the RAM array will receive a BUSY indication, and to output that indication. Any number of slaves to be addressed in the same address range as the master use the BUSY signal as a write inhibit signal. Thus on the IDT70V16/5 RAM the BUSY pin is an output if the part is used as a master (M/S pin = H), and the BUSY pin is an input if the part used as a slave (M/S pin = L) as shown in Figure 3. If two or more master parts were used when expanding in width, a split decision could result with one master indicating BUSY on one side of the array and another master indicating BUSY on one other side of the array. This would inhibit the write operations from one port for part of a word and inhibit the write operations from the other port for the other part of the word. The BUSY arbitration, on a master, is based on the chip enable and address signals only. It ignores whether an access is a read or write. In a master/slave array, both address and chip enable must be valid long enough for a BUSY flag to be output from the master before the actual write pulse can be initiated with the R/W signal. Failure to observe this timing can result in a glitched internal write inhibit signal and corrupted data in the slave.
Busy Logic
Busy Logic provides a hardware indication that both ports of the RAM have accessed the same location at the same time. It also allows one of the two accesses to proceed and signals the other side that the RAM is "busy". The BUSY pin can then be used to stall the access until the operation on the other side is completed. If a write operation has been attempted from the side that receives a BUSY indication, the write signal is gated internally to prevent the write from proceeding. The use of BUSY logic is not required or desirable for all applications. In some cases it may be useful to logically OR the BUSY outputs together and use any BUSY indication as an interrupt source to flag the event of an illegal or illogical operation. If the write inhibit function of BUSY logic is not desirable, the BUSY logic can be disabled by placing the part in slave mode with the M/S pin. Once in slave mode the BUSY pin operates solely as a write inhibit input pin. Normal operation can be programmed by tying
6.42 15
Semaphores
The IDT70V16/5 are extremely fast Dual-Port 16/8Kx9 Static RAMs with an additional 8 address locations dedicated to binary semaphore flags. These flags allow either processor on the left or right side of the Dual-Port RAM to claim a privilege over the other processor for functions defined by the system designer's software. As an example, the semaphore can be used by one processor to inhibit the other from accessing a portion of the Dual-Port RAM or any other shared resource. The Dual-Port RAM features a fast access time, and both ports are
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
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completely independent of each other. This means that the activity on the left port in no way slows the access time of the right port. Both ports are identical in function to standard CMOS Static RAM and can be read from, or written to, at the same time with the only possible conflict arising from the simultaneous writing of, or a simultaneous READ/WRITE of, a nonsemaphore location. Semaphores are protected against such ambiguous situations and may be used by the system program to avoid any conflicts in the non-semaphore portion of the Dual-Port RAM. These devices have an automatic power-down feature controlled by CE, the Dual-Port RAM enable, and SEM, the semaphore enable. The CE and SEM pins control on-chip power down circuitry that permits the respective port to go into standby mode when not selected. This is the condition which is shown in Truth Table I where CE and SEM are both HIGH. Systems which can best use the IDT70V16/5 contain multiple processors or controllers and are typically very high-speed systems which are software controlled or software intensive. These systems can benefit from a performance increase offered by the IDT70V16/5's hardware semaphores, which provide a lockout mechanism without requiring complex programming. Software handshaking between processors offers the maximum in system flexibility by permitting shared resources to be allocated in varying configurations. The IDT70V16/5 does not use its semaphore flags to control any resources through hardware, thus allowing the system designer total flexibility in system architecture. An advantage of using semaphores rather than the more common methods of hardware arbitration is that wait states are never incurred in either processor. This can prove to be a major advantage in very highspeed systems.
How the Semaphore .lags Work
The semaphore logic is a set of eight latches which are independent of the Dual-Port RAM. These latches can be used to pass a flag, or token, from one port to the other to indicate that a shared resource is in use. The semaphores provide a hardware assist for a use assignment method called "Token Passing Allocation." In this method, the state of a semaphore latch is used as a token indicating that shared resource is in use. If the left processor wants to use this resource, it requests the token by setting the latch. This processor then verifies its success in setting the latch by reading it. If it was successful, it proceeds to assume control over the shared resource. If it was not successful in setting the latch, it determines that the right side processor has set the latch first, has the token and is using the shared resource. The left processor can then either repeatedly request that semaphore's status or remove its request for that semaphore to perform another task and occasionally attempt again to gain control of the token via the set and test sequence. Once the right side has relinquished the token, the left side should succeed in gaining control. The semaphore flags are active LOW. A token is requested by writing a zero into a semaphore latch and is released when the same side writes a one to that latch. The eight semaphore flags reside within the IDT70V16/5 in a separate memory space from the Dual-Port RAM. This address space is accessed by placing a LOW input on the SEM pin (which acts as a chip select for the semaphore flags) and using the other control pins (Address, OE, and R/W) as they would be used in accessing a standard static RAM. Each of the flags has a unique address which can be accessed by either side
through address pins A0 - A2. When accessing the semaphores, none of the other address pins has any effect. When writing to a semaphore, only data pin D0 is used. If a low level is written into an unused semaphore location, that flag will be set to a zero on that side and a one on the other side (see Truth Table V). That semaphore can now only be modified by the side showing the zero. When a one is written into the same location from the same side, the flag will be set to a one for both sides (unless a semaphore request from the other side is pending) and then can be written to by both sides. The fact that the side which is able to write a zero into a semaphore subsequently locks out writes from the other side is what makes semaphore flags useful in interprocessor communications. (A thorough discussion on the use of this feature follows shortly.) A zero written into the same location from the other side will be stored in the semaphore request latch for that side until the semaphore is freed by the first side. When a semaphore flag is read, its value is spread into all data bits so that a flag that is a one reads as a one in all data bits and a flag containing a zero reads as all zeros. The read value is latched into one side's output register when that side's semaphore select (SEM) and output enable (OE) signals go active. This serves to disallow the semaphore from changing state in the middle of a read cycle due to a write cycle from the other side. Because of this latch, a repeated read of a semaphore in a test loop must cause either signal (SEM or OE) to go inactive or the output will never change. A sequence WRITE/READ must be used by the semaphore in order to guarantee that no system level contention will occur. A processor requests access to shared resources by attempting to write a zero into a semaphore location. If the semaphore is already in use, the semaphore request latch will contain a zero, yet the semaphore flag will appear as one, a fact which the processor will verify by the subsequent read (see Truth Table V). As an example, assume a processor writes a zero to the left port at a free semaphore location. On a subsequent read, the processor will verify that it has written successfully to that location and will assume control over the resource in question. Meanwhile, if a processor on the right side attempts to write a zero to the same semaphore flag it will fail, as will be verified by the fact that a one will be read from that semaphore on the right side during subsequent read. Had a sequence of READ/WRITE been used instead, system contention problems could have occurred during the gap between the read and write cycles. It is important to note that a failed semaphore request must be followed by either repeated reads or by writing a one into the same location. The reason for this is easily understood by looking at the simple logic diagram of the semaphore flag in Figure 4. Two semaphore request latches feed into a semaphore flag. Whichever latch is first to present a zero to the semaphore flag will force its side of the semaphore flag LOW and the other side HIGH. This condition will continue until a one is written to the same semaphore request latch. Should the other side's semaphore request latch have been written to a zero in the meantime, the semaphore flag will flip over to the other side as soon as a one is written into the first side's request latch. The second side's flag will now stay LOW until its semaphore request latch is written to a one. From this it is easy to understand that, if a semaphore is requested and the processor which requested it no longer needs the resource, the entire system can hang up until a one is written into that semaphore request latch. The critical case of semaphore timing is when both sides request a single token by attempting to write a zero into it at the same time. The
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IDT70V16/5S/L High-Speed 3.3V 16/8K x 9 Dual-Port Static RAM
PRELIMINARY Industrial and Commercial Temperature Ranges
semaphore logic is specially designed to resolve this problem. If simultaneous requests are made, the logic guarantees that only one side receives the token. If one side is earlier than the other in making the request, the first side to make the request will receive the token. If both requests arrive at the same time, the assignment will be arbitrarily made to one port or the other. One caution that should be noted when using semaphores is that semaphores alone do not guarantee that access to a resource is secure. As with any powerful programming technique, if semaphores are misused or misinterpreted, a software error can easily happen. Initialization of the semaphores is not automatic and must be handled via the initialization program at power-up. Since any semaphore request flag which contains a zero must be reset to a one, all semaphores on both sides should have a one written into them at initialization from both sides to assure that they will be free when needed.
Using SemaphoresSome Examples
Perhaps the simplest application of semaphores is their application as resource markers for the IDT70V16/5's Dual-Port RAM. Say the 16K x 9 RAM was to be divided into two 8K x 9 blocks which were to be dedicated at any one time to servicing either the left or right port. Semaphore 0 could be used to indicate the side which would control the lower section of memory, and Semaphore 1 could be defined as the indicator for the upper section of memory. To take a resource, in this example the lower 8K of Dual-Port RAM, the processor on the left port could write and then read a zero in to Semaphore 0. If this task were successfully completed (a zero was read back rather than a one), the left processor would assume control of the lower 8K. Meanwhile the right processor was attempting to gain control of the resource after the left processor, it would read back a one in response to the zero it had attempted to write into Semaphore 0. At this point, the software could choose to try and gain control of the second 8K section by writing, then reading a zero into Semaphore 1. If it succeeded in gaining
control, it would lock out the left side. Once the left side was finished with its task, it would write a one to Semaphore 0 and may then try to gain access to Semaphore 1. If Semaphore 1 was still occupied by the right side, the left side could undo its semaphore request and perform other tasks until it was able to write, then read a zero into Semaphore 1. If the right processor performs a similar task with Semaphore 0, this protocol would allow the two processors to swap 8K blocks of Dual-Port RAM with each other. The blocks do not have to be any particular size and can even be variable, depending upon the complexity of the software using the semaphore flags. All eight semaphores could be used to divide the DualPort RAM or other shared resources into eight parts. Semaphores can even be assigned different meanings on different sides rather than being given a common meaning as was shown in the example above. Semaphores are a useful form of arbitration in systems like disk interfaces where the CPU must be locked out of a section of memory during a transfer and the I/O device cannot tolerate any wait states. With the use of semaphores, once the two devices has determined which memory area was "off-limits" to the CPU, both the CPU and the I/O devices could access their assigned portions of memory continuously without any wait states. Semaphores are also useful in applications where no memory "WAIT" state is available on one or both sides. Once a semaphore handshake has been performed, both processors can access their assigned RAM segments at full speed. Another application is in the area of complex data structures. In this case, block arbitration is very important. For this application one processor may be responsible for building and updating a data structure. The other processor then reads and interprets that data structure. If the interpreting processor reads an incomplete data structure, a major error condition may exist. Therefore, some sort of arbitration must be used between the two different processors. The building processor arbitrates for the block, locks it and then is able to go in and update the data structure. When the update is completed, the data structure block is released. This allows the interpreting processor to come back and read the complete data structure, thereby guaranteeing a consistent data structure.
L PORT SEMAPHORE REQUEST FLIP FLOP D0 WRITE
D Q
R PORT SEMAPHORE REQUEST FLIP FLOP
Q D
D0 WRITE
SEMAPHORE READ
Figure 4. IDT70V16/5 Semaphore Logic
SEMAPHORE READ
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Ordering Information
IDT XXXXX Device Type A Power 999 Speed A Package A Process/ Temperature Range Blank I(1) Commercial (0C to +70C) Industrial (-40C to +85C)
PF J
80-pin TQFP (PN80-1) 68-pin PLCC (J68-1)
15 20 25 S L 70V16 70V15
NOTE: 1. Contact your local sales office for industrial temp range for other speeds, packages and powers.
Commercial Only Commercial & Industrial Speed in Nanoseconds Commercial Only Standard Power Low Power 144K (16K x 9-Bit) 2.5V Dual-Port RAM 72K (8K x 9-Bit) 2.5V Dual-Port RAM
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Datasheet Document History
08/26/02: Initial Public Release
CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054
for SALES: 800-345-7015 or 408-727-6116 fax: 408-492-8674 www.idt.com
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for Tech Support: 831-754-4613 DualPortHelp@idt.com
The IDT logo is a registered trademark of Integrated Device Technology, Inc.


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